Chungeun (Ryan) Kim
Alumni
I worked for the EU project 3D Tune-In at the Dyson School of Design Engineering. My contribution included audio recording/data collection in various configurations (binaural/ambisonic), and assistance in the audio production for mobile app development. I also conducted studies on Head-Related Transfer Function (HRTF) perception and evaluation towards personalised presentation of binaural 3D audio. I currently work as an audio and acoustics R&D engineer at Qualcomm.
Projects
A standard C++ library for audio spatialisation and simulation using headphones
3D Tune-In Toolkit
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Publications
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Tools & Devices
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